Mung Thermal Paste

Finely divided silver powder is blended into vacuum grease to produce an electrically and thermally conductive paste. Typically just a very thin layer is applied. The grease can be removed later with regular solvents found in most labs.

Thin Film Uses for Mung:

Ideal as an interface between wafer pieces and your cooled substrate holder.  The Mung is sticky and will hold a wafer die in place as it rotates or is moved in the vacuum system as long as it remains cold. 

Applications are Ion Beam Etch, Reactive Ion Etch, Metal Evaporation for Lift Off, and any action requires cooling to protect the substrate in a vacuum process.

Each jar of Mung contains 1 oz of fine silver, and the paste has an average thermal conductivity of 18.2 W-m-1K-1

Mung I – Hydrocaron Based Thermal Vacuum Grease (50g)

Intlvac Number:
N/A
$408.00 (USD)

Mung II – Silicon Based Thermal Vacuum Grease (50g)

Intlvac Number:
N/A
$408.00 (USD)